-Designed to removal excesses of composites, adhesives, cements and amalgams from the proximal area. -Also indicated for Inlay and Onlay, laminated vaneers and stripping in orthodontic procedures. Features: – Device developed to adapt special components: Saw Blade: -Remove surplus material without damage the contact point. -Thickness of only 0,05mm. Diamond Strip: -Allows to perform the stripping in orthodontic procedures. -Thickness of only 0,1mm. -Easy and Safe handling. -All components are autoclavable. Kit Contains: -1 Hack saw. -1 saw blade. -1 sanding blade.